BERGQUIST GAP PAD TGP 10000ULM Technical Data Sheet
●A 10.0 W/m-K, extremely soft Gap Pad with exceptional thermal performance at low pressures.
■FEATURES AND BENEFITS
● Thermal Conductivity: 10 W/m-K
● High-compliance, low compression stress
● Ultra low modulus
■BERGQUIST GAP PAD TGP 10000ULM is an extremely soft gap filling material rated at a thermal conductivity of 10.0 W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra low modulus resin formulation.
■BERGQUIST GAP PAD TGP 10000ULM is highly conformal to rough or irregular surfaces, allowing excellent wet-out at the interface. Protective liners are supplied on both sides allowing for ease of use.
|
[ Telecommunications ][ routers ][ switches ][ base stations ][ Optical transceivers ][ ASICs and DSPs ] |
|
|
Datasheet |
|
|
|
|
Please see the document for details |
|
|
|
|
|
|
|
|
|
|
|
English Chinese Chinese and English Japanese |
|
|
February 2020 |
|
|
|
|
|
|
|
|
62 KB |
- +1 Like
- Add to Favorites
Recommend
- High-Performance Thermal Gap Filler Pads to Further Optimise Heat Transfer Applications in Electronic Systems
- What is Air Gap Bonding?
- Waermtimo’s New WT5912 Series Thermal Pad with High Mechanical Strength and Elongation Rate over 300% Can be Used for iPadPro Heat Dissipation
- What Are the Factors that Affect the Thermal Conductivity of Thermal Pad?
- What Is the Design Standard of PCB Pad?
- Does the Thermal Pad Need to Have Glass Fiber?
- Application of Thermal Silicone Pad in Fast Charging Source Adapter
- The Three Factors that Affect the Performance of the Thermal Silicone Pad During Use
All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.
Integrated Circuits
Discrete Components
Connectors & Structural Components
Assembly UnitModules & Accessories
Power Supplies & Power Modules
Electronic Materials
Instrumentation & Test Kit
Electrical Tools & Materials
Mechatronics
Processing & Customization
