BERGQUIST GAP PAD TGP 1000VOUSB Technical Data Sheet
●Ultra Conformable,Thermally Conductive Material for Filling Air Gaps.
■FEATURES AND BENEFITS
●Thermal Conductivity: 1.0 W/m-K
●Highly Conformable, low hardness
●Gel-like” modulus
●Decreased strain
●Puncture, shear and tear resistant
●Electrically isolating
■BERGQUIST GAP PAD TGP 1000VOUSB is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics.
■BERGQUIST GAP PAD TGP 1000VOUSB is an electrically isolating material, which allows its use in applications requiring isolation between eat sinks and high-voltage, bare-leaded devices.
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BERGQUIST GAP PAD TGP 1000VOUSB 、 BERGQUIST GAP PAD VO ULTRA SOFT-B |
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electrically isolating material 、 Ultra Conformable Thermally Conductive Material for Filling Air Gaps |
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[ Various IC packages ][ Telecommunications ][ Automotive ][ LED lighting packages ][ Computer ][ peripherals ] |
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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November 2018 |
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69 KB |
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