BERGQUIST GAP PAD TGP HC1000 Known as BERGQUIST GAP PAD HC1000 Technical Data Sheet
●“Gel-Like” Modulus Gap Filling Material.
■FEATURES AND BENEFITS
● Thermal Conductivity: 1.0 W/m-K
● Highly Conformable, low hardness
● “Gel-like” modulus
● Fiberglass reinforced for puncture, shear and tear resistance
■BERGQUIST GAP PAD TGP HC1000 is an extremely conformable, low-modulus polymer that acts as a thermal interface and electrical insulator between electronic components and heat sinks. The “gel-like” modulus allows this material to fill air gaps to enhance the thermal performance of electronic systems.
■BERGQUIST GAP PAD TGP HC1000 is offered with removable protective liners on both sides of the material.
|
|
|
|
[ Computer and peripherals ][ Telecommunications ][ Heat interfaces to frames ][ chassis ][ heat spreading devices ][ RDRAM™ memory modules ][ chip scale packages ][ CDROM / DVD cooling ][ Areas where irregular surfaces need to make a thermal interface to a heat sink ][ DDR SDRAM memory modules ][ FBDIMM modules ] |
|
|
Datasheet |
|
|
|
|
Please see the document for details |
|
|
|
|
|
|
|
|
|
|
|
English Chinese Chinese and English Japanese |
|
|
October 2018 |
|
|
|
|
|
|
|
|
69 KB |
- +1 Like
- Add to Favorites
Recommend
All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.
Integrated Circuits
Discrete Components
Connectors & Structural Components
Assembly UnitModules & Accessories
Power Supplies & Power Modules
Electronic Materials
Instrumentation & Test Kit
Electrical Tools & Materials
Mechatronics
Processing & Customization
