BERGQUIST GAP PAD TGP HC1000 Known as BERGQUIST GAP PAD HC1000 Technical Data Sheet
●“Gel-Like” Modulus Gap Filling Material.
■FEATURES AND BENEFITS
● Thermal Conductivity: 1.0 W/m-K
● Highly Conformable, low hardness
● “Gel-like” modulus
● Fiberglass reinforced for puncture, shear and tear resistance
■BERGQUIST GAP PAD TGP HC1000 is an extremely conformable, low-modulus polymer that acts as a thermal interface and electrical insulator between electronic components and heat sinks. The “gel-like” modulus allows this material to fill air gaps to enhance the thermal performance of electronic systems.
■BERGQUIST GAP PAD TGP HC1000 is offered with removable protective liners on both sides of the material.
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[ Computer and peripherals ][ Telecommunications ][ Heat interfaces to frames ][ chassis ][ heat spreading devices ][ RDRAM™ memory modules ][ chip scale packages ][ CDROM / DVD cooling ][ Areas where irregular surfaces need to make a thermal interface to a heat sink ][ DDR SDRAM memory modules ][ FBDIMM modules ] |
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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October 2018 |
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69 KB |
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