BERGQUIST® GAP PAD® TGP 6000ULM: SILICONE GAP FILLING MATERIAL
● Key Benefits:
■ Outstanding thermal performance
■ Very low stress
■ Ease of handling
■ High-tack and low-tack sides
■ Reworkable
■ Excellent wet-out characteristics
■ High dielectric strength
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[ power ][ computing ][ consumer ][ telecom ][ automotive sectors ] |
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Supplier and Product Introduction |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2019/10/22 |
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1.2 MB |
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