BERGQUIST® GAP PAD® TGP 6000ULM: SILICONE GAP FILLING MATERIAL

PublishTime：2022-01-27

● For over 50 years, the BERGQUIST® brand has been the trusted leader in thermal management with technology platforms that deliver proven reliability for challenging applications. In keeping with its ongoing innovation initiatives, Henkel has brought to market the latest in the BERGQUIST® GAP PAD® family. For applications where high heat dissipation and low stress are required, Henkel has developed BERGQUIST® GAP PAD® TGP 6000ULM. Ideal for specific devices and systems in the power, computing, consumer, telecom and automotive sectors, BERGQUIST® GAP PAD® TGP 6000ULM offers high thermal conductivity of 6.0 W/m∙K and an ultra-low modulus for reduced stress, particularly for small footprint components with high power density. The silicone-based, non-electrically conductive GAP PAD® is highly conformable, providing excellent coverage on various topographies. BERGQUIST® GAP PAD® TGP 6000ULM is easy to apply and reworkable, as the material provides a low- and a high-tack side and is available in custom-cut shapes for specific device and application requirements.
● Key Benefits:
■ Outstanding thermal performance
■ Very low stress
■ Ease of handling
■ High-tack and low-tack sides
■ Reworkable
■ Excellent wet-out characteristics
■ High dielectric strength

Brand of Product：	Henkel
Part#：	BERGQUIST® GAP PAD® TGP 6000ULM More Part#
Product Category：	More
Application：	[ power ][ computing ][ consumer ][ telecom ][ automotive sectors ] More
Data Type：	Supplier and Product Introduction More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：
Language：	English Chinese Chinese and English Japanese
Date of Creation：	2019/10/22
Version Number：
Data Encoding：
Data Size：	1.2 MB

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