BERGQUIST GAP PAD TGP 6000ULM Technical Data Sheet

2022-01-27
● PRODUCT DESCRIPTION:
■ A high performance, 6 W/m-K silicone thermal interface material with ultra low modulus.
■ Technology: Silicone
■ Appearance: Gray
■ Reinforcement Carrier: Fiberglass
■ Interface Tack: 2 sides
■ Thickness: 1.016 to 3.175mm
■ Application: Thermal management, TIM (Thermal Interface Material)
■ Operating Temperature Range: -60 to 200ºC
■ UL Flammability Rating: UL 94 V-0
● FEATURES AND BENEFITS:
■ Thermal Conductivity: 6.0 W/m-K
■ High-compliance, low compression stress
■ Ultra low modulus

Henkel

BERGQUIST GAP PAD TGP 6000ULM

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Telecommunications ]ASICs ]DSPs ]Consumer electronics ]Thermal modules to heat sinks assembly ]

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October 2019

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