BERGQUIST GAP PAD® TGP 10000ULM:HIGH-COMPLIANCE, LOW COMPRESSION STRESS, ULTRA-LOW MODULUS GAP PAD®

PublishTime：2022-04-07

Henkel's BERGQUIST GAP PAD® TGP 10000ULM unites very high thermal conductivity and ultra-low modulus to address the demands of next-generation telecom and datacom applications. With power densities and thermal loads increasing while devices continue to reduce in footprint, heat dissipation in combination with low assembly stress is required for optimal performance and reliability. BERGQUIST GAP PAD TGP 10000ULM is a soft, conforming pad that provides excellent wet out at the interface even on rough or irregular surfaces, delivering optimized thermal transfer and minimizing assembly stress. Formulated on a silicone-based resin platform, the materials are supplied in pre-cut pads with tack on both sides for easy application.

Brand of Product：	BERGQUIST
Part#：	TGP 10000ULM More Part#
Product Category：	conforming pad 、 GAP PAD More
Application：	[ Telecommunications ][ routers ][ switches ][ base stations ][ Optical Transceivers ][ ASICs ][ DSPs ] More
Data Type：	Datasheet More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：
Language：	English Chinese Chinese and English Japanese
Date of Creation：	2020/1/17
Version Number：
Data Encoding：
Data Size：	1.2 MB

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