Waermtimo’s New WT5912 Series Thermal Pad with High Mechanical Strength and Elongation Rate over 300% Can be Used for iPadPro Heat Dissipation

PublishTime： 2023-09-23 Article Source：Waermtimo News

The new electronic products come out on the market every fall apart from the iPhone series, just the iPad series.

IPad is the intermediate product between smartphones and notebook computers, with more and more powerful functions, chase, and play games, and even the drawing function added in the last two years, it has expanded work and entertainment performance.

Let's take a look at the internal structure. How many black technologies are there?

The electronic mask layer of the motherboard

The role of this thin layer is not only to protect the motherboard, but also to hide the cable connector, and also to fix the motherboard on the iPad Pro back case.

Its motherboard is located in the center of the interior, and the display cable is also connected in the center. The components on the motherboard are relatively dense, with processors, 2 memories, flash memory, gyroscope and accelerometer combination, Wi-Fi modules, controllers, and audio codecs, etc.

As tablet PCs become thinner and slimmer, they need to use passive cooling, so a thermal pad can be seen on the processor for heat conduction. The thermal pad has a certain ductility, can fill the gap, and has elasticity, which can play the function of shock absorption and component protection.

What kind of thermal pad can be used on tablets?

Recommended models

WT5912 series thermal pad

Model: WT5912-H20-55, WT5912-H25-40

Waermtimo researched and developed TIM's new high-strength thermal pad, which is a thermally conductive sheet with high mechanical strength, elongation rate> 300%, high toughness, thermal conduction, and shock absorption at the same time. It can not be fractured and can tightly integrate irregular or complex surfaces, has excellent interface filling, and can be used repeatedly. Temperature resistance range -50 ~ 200℃, applicable to a wide range of power equipment, automotive electronics, communication equipment, network terminals, storage devices, handheld, wearable, and mobile terminal products between the internal chip and the radiator. This series pad can be used to solve the problem of heat conduction and heat dissipation. At the same time, it can also be applied to the housing of some electronic products, which have the functions of heat dissipation, insulation, dust resistance, and water resistance.

WT5902 series thermal pad

Model: WT5902-D40-40, WT5902-D45-40

Thermal conductivity range: 4W, 5W, 6W, 7W, 8W

WT5902 series thermal pads can solve the problem of tolerance changes when designing the product structure and can be reused. They are vertical heat transfer materials between the heat source (CPU or electronic chipset) and the heat sink. Have good insulation and mechanical properties, can tightly integrate irregular or complex surfaces, are easy to use, and are easy to remove. They are widely used in power supply equipment, automotive electronics, communication equipment, network terminals, storage devices, consumer electronics, and other fields.

+1 Like
Add to Favorites

Recommend

Technical Resources

More>

New Products & Solutions

More>

This document is provided by Sekorm Platform for VIP exclusive service. The copyright is owned by Sekorm. Without authorization, any medias, websites or individual are not allowed to reprint. When authorizing the reprint, the link of www.sekorm.com must be indicated.

Integrated Circuits