Waermtimo WT5912 and WT5902 Series Thermal Pads Tightly Integrate Irregular or Complex Surfaces, Suitable for Wireless Routers
The wireless router provides a very convenient network environment for work, office, and home entertainment, allowing us to get rid of the shackles of network cables and enjoy a variety of network equipment within the signal coverage area. Although it has a low daily presence, it plays a very important role.
In such a device that works 24/7, the internal components continuously generate heat, and the heat transfer system design requirements are also very high.
For a router produced by a well-known domestic brand manufacturer, by decrypting the internal structure, let's see how it dissipates heat.
There are cooling holes on the bottom of the router, and convection is formed by the internal turbo fan. In order to have better air duct heat dissipation, all places are closed except for the heat dissipation holes at the bottom.
Due to the high main frequency of the internal chip, some manufacturers choose to actively dissipate heat. The consequence is that after a long period of operation, the fan noise will generally increase.
In contrast, products using a passive cooling method, where a thermal pad is placed between the IC's main chip and the heat sink, avoid such problems and enhance the heat dissipation effect.
What is the excellent performance thermal pad suitable for wireless routers?
Recommended models:
WT5912 series thermal pad
Model: WT5912-H20-55, WT5912-H25-40
Waermtimo researched and developed TIM's new high-strength thermal pad, which is a thermal sheet with high mechanical strength, elongation rate> 300%, high toughness, thermal shock, and effective damping at the same time, and can be reworked many times. Continuously, it can tightly integrate irregular or complex surfaces, has excellent interface filling, and can be used repeatedly. Temperature resistance range -50 ~ 200℃, applicable to a wide range of power equipment, automotive electronics, communication equipment, network terminals, storage devices, handheld, wearable, and mobile terminal products between the internal chip and the radiator, this type of pad can be used to solve the problem of heat conduction and heat dissipation. At the same time, it can also be applied to the housing of some electronic products, which has the functions of heat dissipation, insulation, dust resistance, and water resistance.
WT5902 series thermal pad
Model: WT5902-D40-40, WT5902-D45-40
Thermal conductivity range: 4W, 5W, 6W, 7W, 8W
WT5902 series thermal pads can solve the problem of product structure design tolerance changes and can be reused. They are good vertical heat transfer materials between the heat source (CPU or electronic chipset) and the heat sink. Have good insulation and mechanical properties, can tightly integrate irregular or complex surfaces, are easy to use, and are easy to remove. They are widely used in power supply equipment, automotive electronics, communication equipment, network terminals, storage devices, consumer electronics, and other fields.
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