High-Performance Thermal Gap Filler Pads to Further Optimise Heat Transfer Applications in Electronic Systems
The Parker Chomerics is introducing its next generation of thermal gap filler pads - THERM-A-GAPTM PAD 30 and 60 - for all heat transfer applications between electronic components and heat sinks.
With a dependable thermal performance of 3.2 W/m-K, the cost-effective THERM-A-GAP PAD 30 reliably conforms to rough surface irregularities and air gaps on heat generating components. For higher performance applications, THERM-A-GAP PAD 60 offers the enticing combination of excellent thermal conductivity at 6.0 W/m-K, while being 40% softer than current high-performance thermal gap pad offerings from Parker Chomerics.
With their special formulation, THERM-A-GAP PAD 30 and THERM-A-GAPTM PAD 60 ensure complete conformability (with low clamping forces) and the lowest outgassing, thus providing an effective thermal interface wherever uneven surface irregularities, air gaps or rough textures are prevalent. The products are ideal for use in general industrial, life science and consumer markets. Typical applications extend from telecommunications equipment, automotive electronics, and lighting LEDs, through to power conversion systems, consumer electronics, desktop/laptop computers, servers, handheld devices and memory modules. THERM-A-GAP PAD 30 and 60 are also highly effective in vibration-dampening applications.
Aside from excellent thermal performance, further advantages include ultra-low deflection force and high-tack surfaces to help reduce contact resistance.
“Thermal gap filler pads continue to be designed and used in greater capacities for price-sensitive markets, as well as those requiring high-performance materials,”says Brian Mahoney, thermal business unit manager, Chomerics Division. “We're thrilled to expand our already impressive family of thermal gap filler pads with these next-generation offerings.”
Manufactured globally, THERM-A-GAP PAD 30 and 60 come in a range of standard sheet sizes and thicknesses, although custom dimensions are available upon request. Parker Chomerics can also supply the products with various carrier options for ease-of-application and use.
- 【Datasheet】THERM-A-GAP™ PAD 30: 3.2 W/m-K Thermally Conductive Very Low Compression Force Gap Filler Pad
- 【Datasheet】THERM-A-GAP™ PAD 60 6.0 W/m-K Thermally Conductive Low Compression Force Gap Filler Pad
- 【Datasheet】THERM-A-GAP™ PAD 60 ULTRA-SOFT, HIGH PERFORMANCE THERMALLY CONDUCTIVE GAP FILLER PAD
- 【Datasheet】THERM-A-GAP™ PAD 60 ULTRA-SOFT, HIGH PERFORMANCE THERMALLY CONDUCTIVE GAP FILLER PAD
- 【Datasheet】THERM-A-GAP™ PAD 30 3.2 W/m-K THERMALLY CONDUCTIVE GAP FILLER PAD
- +1 Like
- Add to Favorites
Recommend
- Parker Chomerics‘ THERM-A-GAP™ Gel 20 One-component Thermal Interface Material with 2.4W/m-k Thermal Conductivity Ideal for Automotive Industry Applications
- New THERM-A-GAP GEL 75 Thermal Gel Offers High Thermal Conductivity and Reliability
- The Next Generation of Thermal Gap Filler Pad: THERM-A-GAP PAD 80LO, with a Thermal Conductivity of 8.3 W/m-K
- Advanced Battery Energy Storage Systems (BESS) Solutions: Parker Chomerics 6.0W/m-K THERM-A-FORM CIP 60
- Parker Chomerics THERM-A-FORM CIP 60: 6.0W/m-K Dispensable Thermal Cure-in-Place and Gap Filler Material
- Parker Releases High-Flow Thermal Gel THERM-A-GAP™ GEL 60HF Offering Flow Rates of up to 100g/min for High-Volume Applications
- 5.2W/m-K High Reliability, Fully Cured, Dispensable Thermal Gel from Parker Chomerics
- News | Thermal Interface Materials for Challenging Private Spaceflight Applications
This document is provided by Sekorm Platform for VIP exclusive service. The copyright is owned by Sekorm. Without authorization, any medias, websites or individual are not allowed to reprint. When authorizing the reprint, the link of www.sekorm.com must be indicated.