Parker Chomerics THERM-A-FORM CIP 60: 6.0W/m-K Dispensable Thermal Cure-in-Place and Gap Filler Material
Parker Chomerics THERM-A-FORM CIP 60 is a two-component (2k) dispensable thermal gap filler and cure-in-place material with 6.0 W/m-K thermal conductivity. CIP 60 is designed to be an alternative to hard-curing dispensable materials but also an provide an improvement over standard application methods associated with thermal gap filler pads.
As a two-component dispensable material, it has an excellent flow rate and can be dispensed in high volumes or used to fill applications that require heat transfer in challenging geometries.
With a 1:1 mix ratio and packaged in cartridges of various sizes, this material can be easily dispensed through a static mixing tip using either manual or automated dispensing equipment.
Dispensable Thermal Cure-in-Place and Gap Filler Material Product Features
Two-part (2k) dispensable material
Excellent thermal performance (6.0 W/m-K)
Excellent flow rate for high-speed dispensing
Conformable to irregular shapes
No pre-mixing or weighing of components required
Vibration dampening
Typical Applications
Automotive E-Mobility (converters, inverters)
Automotive Infortainment (Display, HUD, Audio)
Automotive ADAS (DCU, Camera, Radar/Lidar)
SSD (Enterprise, Consumer)
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