THERM-A-GAP™ PAD 30: 3.2 W/m-K Thermally Conductive Very Low Compression Force Gap Filler Pad
■Parker Chomerics THERM-A-GAP™ PAD 30 is a thermally conductive, electrically isolating gap filler pad with a thermal conductivity of 3.2 W/m‐K. Designed to provide effective heat transfer between electronic devices, heat sinks, or other cooling features, THERM‐A‐GAP PAD 30 offers the ideal combination of heat transfer, low outgassing, and low compressing forces. With a Shore 00 hardness measurement of 30, it is designed to maintain conformability in gaps that contain uneven mating surfaces, air gaps, or where rough surface texture is a concern.
■THERM‐A‐GAP PAD 30 was developed to be a universal solution across applications and industries requiring a moderate level of thermal performance in electronic device designs. It is a cost‐effective solution and optimized for flexibility of design with several material carrier options available and ease of customization to unique shapes and sizes.
●Product Features
■3.2 W/m-K thermal conductivity
■Very low compression force
■Very good thermal conductivity
■High tack surface reduces contact resistance
■“A” version offers high strength acrylic PSA for permanent attachment
■UL recognized V-0 flammability
■RoHS compliant
■Vibration dampening
|
THERM-A-GAP™ PAD 30 、 PAD 30 、 6W-XX-0909-ZZZZZZZ 、 69-1X-YYYYY-ZZZZZZZ 、 THERM-A-GAP PAD 30 |
|
|
Thermally Conductive Very Low Compression Force Gap Filler Pad 、 thermally conductive, electrically isolating gap filler pad |
|
|
[ Telecommunications equipment ][ Consumer electronics ][ Automotive electronics ][ ECUs ][ LEDs ][ lighting ][ Power conversion ][ Desktop computers ][ laptops ][ servers ][ Handheld devices ][ Memory modules ] |
|
|
Datasheet |
|
|
|
|
Please see the document for details |
|
|
|
|
|
|
|
|
|
|
|
English Chinese Chinese and English Japanese |
|
|
February 2023 |
|
|
|
|
|
CHODS1003 |
|
|
404 KB |
- +1 Like
- Add to Favorites
Recommend
- Parker Chomerics‘ THERM-A-GAP™ Gel 20 One-component Thermal Interface Material with 2.4W/m-k Thermal Conductivity Ideal for Automotive Industry Applications
- Parker Releases High-Flow Thermal Gel THERM-A-GAP™ GEL 60HF Offering Flow Rates of up to 100g/min for High-Volume Applications
- New THERM-A-GAP GEL 75 Thermal Gel Offers High Thermal Conductivity and Reliability
- 5.2W/m-K High Reliability, Fully Cured, Dispensable Thermal Gel from Parker Chomerics
- High-Performance Thermal Gap Filler Pads to Further Optimise Heat Transfer Applications in Electronic Systems
- On the Cutting Edge: How Parker Chomerics Helps SpaceX Soar
- News | Thermal Interface Materials for Challenging Private Spaceflight Applications
- QSFP-DD Optical Transceiver Thermal Interface Materials with Greater Density, Greater Heat
All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.
Integrated Circuits
Discrete Components
Connectors & Structural Components
Assembly UnitModules & Accessories
Power Supplies & Power Modules
Electronic Materials
Instrumentation & Test Kit
Electrical Tools & Materials
Mechatronics
Processing & Customization
