THERM-A-GAP™ PAD 30 3.2 W/m-K THERMALLY CONDUCTIVE GAP FILLER PAD
■Parker Chomerics THERM-A-GAP™ PAD 30 is a thermally conductive gap filler pad with 3.2 W/m-K thermal conductivity.
■THERM-A-GAP PAD 30 offers the compelling combination of both excellent thermal performance and conformablility, along with the lowest outgassing to provide an effective thermal interface between heat sinks and electronic devices where there are uneven surfaces, air gaps and rough surface textures.
■THERM-A-GAP PAD 30 has been specifically formulated to conform to surface irregularities and adhere to a wide range of component shapes and sizes.
●Product Features:
■3.2 W/m-K thermal conductivity
■Ultra low deflection force
■High thermal conductivity
■High tack surface reduces contact resistance
■“A” version offers high strength acrylic PSA for permanent attachment
■UL recognized V-0 flammability RoHS compliant
●Typical Applications:
■Telecommunications equipment
■Consumer electronics
■Automotive electronics (ECUs)
■LEDs, lighting
■Power conversion
■Desktop computers, laptops, servers
■Handheld devices
■Memory modules
■Vibration dampening
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THERM-A-GAP™ PAD 30 、 THERM-A-GAP PAD 30 、 PAD30G 、 PAD30A 、 PAD 30 、 PAD30PN 、 PAD30KT |
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[ Telecommunications equipment ][ Consumer electronics ][ Automotive electronics (ECUs) ][ LEDs ][ lighting ][ Power conversion ][ Desktop computers ][ laptops ][ servers ][ Handheld devices ][ Memory modules ][ Vibration dampening ] |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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30 November 2021 |
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741 KB |
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