THERM-A-GAP™ PAD 60 Test Report
■THERM-A-GAP™ PAD 60 is a soft, highly reliable, high-performance 6.0 W/m-K thermally conductive pad.
■This document outlines the examination of the thermal reliability of this silicone-based gap filler pad after being subjected to long-term environmental aging.
■The thermal performance of THERM-A-GAP™ PAD 60 was examined after being subjected to multiple environmental stress tests. The thermal impedance of the aged samples did not experience a significant increase after any of the treatments studied.
■Samples were subjected to 1000-hour dwell at 125°C, 1000-hour dwell at 85°C/85% relative humidity, and a combined stress of thermal shock at -40°C to 80°C, thermal cycling at -40°C to 80°C, and random vibration frequencies equivalent to 2.0 GRMS. In all cases, there was no statistically significant increase in impedance according to one-way ANOVA with the Tukey method for multiple comparisons.
■Based on these results, THERM-A-GAP™ PAD 60 demonstrates the ability to withstand long-term aging without a reduction in thermal performance.
●Introduction
■The purpose of this document is to examine the thermal reliability of this high-performance thermal pad. Samples of production-scale batches were subjected to long-term aging conditions, and the thermal performance was measured over time.
■Successful survival of long-term aging is demonstrated by a lack of statistically significant increase in thermal impedance of the reliability fixtures after the full aging duration. The reliability fixtures comprise PAD 60 sandwiched between two stainless-steel coupons, with thickness set by PTFE spacers.
■It is worth noting that the exact impedance value of the reliability fixture is not representative of the impedance value of the thermal interface material itself, but it can be used to measure changes to thermal performance over time.
●Results
■To summarize the above results, THERM-A-GAP™ PAD 60 is highly reliable after long-term aging in multiple environments.
■The mean impedance values after dry heat aging, heat and humidity aging, and thermal shock + thermal cycling + random vibration aging saw a decrease of 2.5%, 5.7% and 1.9% from initial.
■A decrease in thermal impedance indicates an improved thermal performance post-stress. This can likely be attributed to an enhanced wetting at the interface between the thermal pad and the substrate.
■In addition, the physical and chemical properties of the pad remained unchanged as we see an outgassing result of 0.04% and minimal change in deflection force within the compression ranges recommended for application.
■The results of this study provide evidence that PAD 60 maintains reliability after long-term aging.
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Test Report |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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November 2021 |
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Rev. A |
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TR1122 |
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1022 KB |
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