THERM-A-GAP™ PAD 80 8.3 W/m-K Thermally Conductive High Performance Gap Filler Pad
●THERM-A-GAP™ PAD 80 is designed to serve as an effective thermal interface between heat sinks and heat generating components on electronic devices where uneven surfaces, air gaps, and rough surfaces may exist.
●PAD 80 is available in standard thicknesses as low as 0.030” to 0.200” (0.76mm to 5.1mm) and can be provided in sheets or cut to custom part sizes. It is available on several material carriers including an aluminum foil carrier that is supplied with pressure sensitive adhesive (PSA) for added adhesive strength during the assembly process.
●Product Features
■8.3 W/m-K thermal conductivity
■Very low compression force
■Electrically isolating
■UL 94 V-0 flammability rating
■“A” version offers high strength acrylic PSA for permanent attachment
■Passes NASA outgassing requirements
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Thermally Conductive High Performance Gap Filler Pad 、 high performance, thermally conductive gap filler pad |
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[ 5G equipment ][ Telecom equipment ][ Smart home devices ][ Automotive electronics ][ LEDs ][ Power supplies ][ Computing modules ][ servers ][ Memory ][ data storage units ] |
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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September 2023 |
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506 KB |
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