THERM-A-GAP™ PAD 80 8.3 W/m-K Thermally Conductive High Performance Gap Filler Pad

2025-03-19
Parker Chomerics THERM-A-GAP™ PAD 80 is a high performance, thermally conductive gap filler pad with a typical thermal conductivity of 8.3 W/m-K. It provides excellent heat transfer over a wide range of thicknesses while maintaining low compression force and surface matching adaptability. THERM-A-GAP™ PAD 80 is designed to be an effective thermal interface between heat sinks and heat sources in electronic devices, suitable for applications with uneven surfaces, air gaps, and rough surfaces. The product is available in standard thicknesses from 0.030” to 0.200” (0.76mm to 5.1mm) and can be provided in custom sizes. It is available in various material substrates, including foil with pressure sensitive adhesive (PSA) to increase bonding strength during assembly.

Parker Chomerics

THERM-A-GAP™ PAD 80

More

Part#

热传导间隙填充垫

More

5G 和电信设备 ]智能家居设备 ]汽车电子产品 ]LED ]电源 ]计算模块和服务器 ]内存和数据存储单元 ]

More

Supplier and Product Introduction

More

More

Please see the document for details

More

More

可定制尺寸

English Chinese Chinese and English Japanese

518 KB

- The full preview is over. If you want to read the whole 3 page document,please Sign in/Register -
  • +1 Like
  • Add to Favorites

Recommend

All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.

Contact Us

Email: