THERM-A-GAP™ PAD 30 3.2 W/m-K Thermally Conductive Very Low Compression Force Gap Filler Pad

2025-03-19
Parker Chomerics THERM-A-GAP™ PAD 30 is a thermally conductive, electrically insulating gap filler pad with a thermal conductivity of 3.2 W/m-K. It is designed to provide effective heat transfer between electronic devices, heat sinks, or other cooling functions. THERM-A-GAP PAD 30 combines the ideal combination of heat transfer, low outgassing, and low compression force. Its Shore 00 hardness is 30, suitable for maintaining the adaptability of gaps between unevenly matched surfaces, air gaps, or rough surface textures. The product is suitable for electronic device designs that require moderate thermal performance and is a cost-effective solution with multiple material carrier options and easy customization of unique shapes and sizes.

Parker Chomerics

THERM-A-GAP™ PAD 30

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热导率间隙填充垫

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电信设备 ]消费电子产品 ]汽车电子产品 ]LED 和照明 ]电源转换 ]台式电脑 ]笔记本电脑 ]服务器 ]手持设备 ]内存模块 ]

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