Customer Value
Proposition
Parker Chomerics THERM-A-GAP™
PAD 30 is a thermally conductive,
electrically isolating gap filler pad with
a thermal conductivity of 3.2 W/m‐K.
Designed to provide effective heat
transfer between electronic devices,
heat sinks, or other cooling features,
THERM‐A‐GAP PAD 30 offers the
ideal combination of heat transfer,
low outgassing, and low compressing
forces. With a Shore 00 hardness
measurement of 30, it is designed to
maintain conformability in gaps that
contain uneven mating surfaces, air
gaps, or where rough surface texture is
a concern.
THERM‐A‐GAP PAD 30 was developed
to be a universal solution across
applications and industries requiring a
moderate level of thermal performance
in electronic device designs. It is a
cost‐effective solution and optimized for
flexibility of design with several material
carrier options available and ease of
customization to unique shapes and sizes.
Product Features
• 3.2 W/m-K thermal conductivity
• Very low compression force
• Very good thermal conductivity
• High tack surface reduces
contact resistance
• “A” version offers high strength
acrylic PSA for permanent
attachment
• UL recognized V-0 flammability
• RoHS compliant
• Vibration dampening
Contact Information
Parker Hannifin Corporation
Chomerics Division
77 Dragon Court
Woburn, MA 01801
phone 781 935 4850
fax 781 933 4318
chomailbox@parker.com
parker.com/chomerics
Typical Applications
• Telecommunications equipment
• Consumer electronics
• Automotive electronics (ECUs)
• LEDs and lighting
• Power conversion
• Desktop computers, laptops,
servers
• Handheld devices
• Memory modules
THERM-A-GAP
™
PAD 30
3.2 W/m-K Thermally Conductive
Very Low Compression Force Gap Filler Pad
THERM-A-GAP
™
PAD 30 Product Information
† Typical properties: these are not to be construed as specifications.
* Thickness tolerance, inches (mm) is ±10% of the nominal part thickness for parts 0.100” (2.5mm) thick or less; those parts greater than 0.100” (2.5mm) thick are held to ±0.010”
(±0.25mm).
** The typical deflection range is approximately 5-40%.
THERM-A-GAP PAD 30
Typical Properties
†
PAD 30 Test Method
Physical
Color Blue Visual
Carrier Options:
G = Woven glass - no pressure sensitive adhesive (PSA)
A = Aluminum foil - with PSA
PN = PEN film
KT = Thermally enhanced polyimide
No letter suffix = None (unsupported)
PAD30G
PAD30A
PAD30PN
PAD30KT
PAD30
--
Standard Thicknesses*, in. (mm)
0.020 – 0.200
(0.51 – 5.08)
ASTM D374
Specific Gravity 2.9 ASTM D792
Hardness, Shore 00 30 ASTM D2240
Percent Deflection @ Various Pressures**
(0.120 in thick sample)
@ 5 psi (34 kPa)
@ 10 psi (69 kPa)
@ 25 psi (172 kPa)
@ 50 psi (345 kPa)
% Deflected
17%
26%
38%
49%
ASTM C165 MOD
(0.120 in with no Carrier,
0.50 in dia. probe,
0.025 in/min rate)
Thermal
Operating Temperature Range, °F (°C)
-67 to 392
(-55 to 200)
Chomerics
Thermal Conductivity, W/m-K 3.2 ASTM D5470
Thermal Impedance, °C-in
2
/W (°C-cm
2
/W)
@ 10 psi, @ 0.04 in. (1mm) thick, “G” version
0.4 (2.6) ASTM D5470
Heat Capacity, J/g-K 1 ASTM E1269
Coefficient of Thermal Expansion, ppm/K 150 ASTM E831
Electrical
Dielectric Strength, V
AC
/mil (kV
AC
/mm) 150 (5.9) ASTM D149
Volume Resistivity, ohm-cm 10
13
ASTM D257
Dielectric Constant @ 1,000 kHz and at 0.039 (1mm) thick 7.7 ASTM D150
Dissipation Factor @ 1,000 kHz and at 0.039 (1mm) thick 0.001 CHO-TM-TP13
Regulatory
Flammability Rating
(See UL File E140244 for Details)
V-0 UL 94
RoHS Compliant Yes Chomerics Certification
Outgassing, % TML (% CVCM) 0.13 (0.03) ASTM E595
Shelf Life, months from date of shipment (PAD 30A) 36 (18) Chomerics
Storage Conditions, °F (°C) @ 50% Relative Humidity
50 to 90
(10 to 32)
Chomerics