BERGQUIST GAP PAD TGP 2000SF Technical Data Sheet
■ Thermally Conductive, Silicone-Free Gap Filling Material.
■ Technology: Silicone free
■ Appearance: Green
■ Reinforcement Carrier: Fiberglass
■ Thickness, ASTM D374: 0.254 to 3.175mm
■ Inherent Surface Tack: 2 (1 or 2 sided)
■ Application: Thermal management, TIM (Thermal Interface Material)
■ Operating Temperature Range: -60 to 125ºC
● FEATURES AND BENEFITS:
■ High Thermal Conductivity: 2 W/m-K
■ Natural inherent tack reduces interfacial thermal resistance and aids assembly
■ Conforms to demanding contours and maintains structural integrity with little stress applied to fragile component leads
■ Fiberglass reinforced for puncture, shear and tear resistance
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[ Automotive brushed motors ][ Optical applications ][ Set top boxes ][ Hard drives ][ Relays ][ other electrical components ] |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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April 2019 |
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68 KB |
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