BERGQUIST GAP PAD TGP EMI1000 Thermally Conducive, Conformable EMI Absorbing Malarial Technical Data Sheet
●Thermally Conductive, Conformable EMI Absorbing Material.
▲Technology：Silicone
▲Appearance：Black
▲Reinforcement Carrier：Fiberglass
▲Thickness：0.508 to 3.175mm, ASTM D374
▲Inherent Surface Tack：1
▲Application：Thermal management, TIM (Thermal Interface Material)
▲Operating Temperature Range：-60 to 200°C
■FEATURES AND BENEFITS
◆Thermal Conductivity: 1.0 W/m-K
◆Electromagnetic Interference (EMI) absorbing
◆Highly Conformable, low hardness
◆Fiberglass reinforced for puncture, shear and tear resistance
◆Electrically isolating
■BERGOUIST GAP PAD TGP EMI 1000 is a highly conformable, combination gap filling material offering both thermal conductivity performance and Electromagnetic Energy absorption (cavity resonances and/or cross-talk causing Electromagnetic Interference) at frequencies of 1GHz and higher. The material offers EMI suppression and 1.0 W/m-K thermal conductivity performance with low assembly stress. The soft nature of the material enhances wet-out at the interface resulting in better thermal performance than harder materials with a similar performance rating.
■BERGOUIST GAP PAD TGP EMI 1000 has an inherent, natural tack on one side of the material eliminating the need for thermally-impeding adhesive layers and allowing improved handling during placement and assembly. The other side is tack-free, again enhancing handling and rework, if required.
BERGOUIST GAP PAD TGP EMI 1000 is supplied with a protective liner on the material's tacky side.
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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October-2018 |
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69 KB |
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