TitanKlean® Cu Advanced post-etch residue removal solution
●TitanKlean Cu formulated solutions provide one-step hard mask removal and post-etch clean and are compatible with relevant exposed thin films materials. In addition to the excellent reliability and yield, these proprietary formulations have specifically been designed to provide significant cost of ownership benefits.
●Throughput and consumption benefits are realized through increased hard mask removal rate and the ability to utilize the chemical in recycle mode.
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2017/9/14 |
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491 KB |
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