TitanKlean® Cu Advanced post-etch residue removal solution

2022-10-21
●As pattern geometries become increasingly smaller and more complex, removing the metal hard mask during the post-etch residue removal process becomes more desirable. The major roadblock to implementing this step previously has been the incompatibility of potential mask removal chemistries with other materials that are present. In some cases, these materials are very similar to the hard mask material itself, adding complexity to an already difficult challenge. TitanKlean® Cu was designed to enable this step while also delivering significant cost savings.
●TitanKlean Cu formulated solutions provide one-step hard mask removal and post-etch clean and are compatible with relevant exposed thin films materials. In addition to the excellent reliability and yield, these proprietary formulations have specifically been designed to provide significant cost of ownership benefits.
●Throughput and consumption benefits are realized through increased hard mask removal rate and the ability to utilize the chemical in recycle mode.

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2017/9/14

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