REGENSI® 31
■RegenSi® 31 silicon process efficiency solutions offer compelling value propositions focused on reducing the overall cost of silicon for manufacturers. RegenSi 31 is adept at removing most films commonly used in the industry at a higher rate than commodities, such as dilute HF, while leaving the Si wafer surface extremely smooth. This high selectivity for metal and non-metal films over the silicon substrate enables the minimization, and possible elimination, of wafer polishing. By minimizing polish-induced silicon loss, wafers can be re-used more times, resulting in substantial cost savings.
●Product Selection
■RegenSi 31 is the baseline wafer reclaim product. Entegris also offers a variety of specialized products tuned to various customer needs. The selection of the optimum product is determined by the type of films to be etched, the operating parameters that are most desired for the etch requirements, and material selectivity desired.
●Advantages
■Reduced process times
■High dielectric-selective etch rates
■Minimizes Si roughening
■Minimizes need for post-clean CMP
●Usage
■RegenSi 31 wafer reclaim solutions products are formulated as ready-to-use solutions; no dilution of the products is required or recommended. The products can to be used in either batch immersion, batch spray or single wafer applications, and can often be implemented as a simple drop-in alternative to products currently in use.
●Handling, Storage and Packaging
■Before using this product, read the MSDS. RegenSi 31 products are available in 1-gallon and 55-gallon packages.
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2015/9/4 |
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537 KB |
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