PlanarClean® Formulated Solutions

PublishTime：2022-10-21

●PlanarClean® is the next-generation post-CMP copper cleaning product designed for use following the barrier CMP step. Formulated using our high-productivity testing and devel-opment process, PlanarClean comes as an aqueous solution with strong-acting agents that are very effective at preventing copper corrosion during and after the cleaning process. In addition, PlanarClean is compatible with copper and various dielectric materials, including porous low-k. It is also compatible with all major CMP platforms (Applied Materials®, Ebara®, etc.). PlanarClean requires no additional heating (used at ambient temperature). With PlanarClean, you can proceed with the confidence, effectiveness and efficiency that come from using Entegris copper integration products.
●HIGHLIGHTS
■Compatible with low-k
■Applicable for all CMP platforms
■Excellent organic residue removal
■Improved electrical performance (TDDB)
■Low copper roughness
■Low cost of ownership
■No special waste treatment required for disposal
■Effective metallic contamin-ation removal from dielectric
■No copper corrosion during extended queue time

Brand of Product：	Entegris
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Product Category：	More
Application：	More
Data Type：	Datasheet More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
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Language：	English Chinese Chinese and English Japanese
Date of Creation：	2018/1/17
Version Number：
Data Encoding：
Data Size：	1.9 MB

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