RegenSi® 74
●The RegenSi 74 solution maintains core characteristics of the RegenSi family of solutions, especially extremely high selectivity to silicon resulting in rapid film removal with no damage to the underlying silicon (wafer recycle). This minimizes – and in some cases eliminates – the need for expensive post-film strip process-ing such as CMP or silicon polish (wafer reclaim). RegenSi 74 has also been designed to operate at ambient room temperature. For maximum metal and dielectric wafer recycle/reclaim process efficiency, use RegenSi 74.
●FEATURES & BENEFITS
■One chemical process for complete stack removal (metal, barrier, dielectric)
■Ambient room temperature operation
■Minimal silicon surface damage
■Increased uptime (fewer bath changes)
■Compatible with standard HF tank in a wet bench
■8x reduction in chemical usage per wafer
■Reduced costs for waste and energy
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2017/6/21 |
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453 KB |
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