RegenSi® 74

2022-07-04
●RegenSi® 74 is the next-generation test wafer recycle chemistry specifically formulated to provide a single-step process for removal of complete test metallization schemes. Capable of rapidly removing aluminum and copper stacks, RegenSi 74 can be implemented on all major wet bench platforms (HF compatible) to replace existing two- or three-chemical process steps for efficiency gains. Using RegenSi 74 results in reduced chemical usage, reduced waste volumes and greatly-reduced rinse volumes.
●The RegenSi 74 solution maintains core characteristics of the RegenSi family of solutions, especially extremely high selectivity to silicon resulting in rapid film removal with no damage to the underlying silicon (wafer recycle). This minimizes – and in some cases eliminates – the need for expensive post-film strip process-ing such as CMP or silicon polish (wafer reclaim). RegenSi 74 has also been designed to operate at ambient room temperature. For maximum metal and dielectric wafer recycle/reclaim process efficiency, use RegenSi 74.
●FEATURES & BENEFITS
■One chemical process for complete stack removal (metal, barrier, dielectric)
■Ambient room temperature operation
■Minimal silicon surface damage
■Increased uptime (fewer bath changes)
■Compatible with standard HF tank in a wet bench
■8x reduction in chemical usage per wafer
■Reduced costs for waste and energy

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2017/6/21

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