EPC2055 EPC eGaN® FET Qualification Report

PublishTime：2021-04-20

The testing matrix in this qualification report covers the qualification of EPC2055.For some tests,EPC2055 was qualified by matrix with EPC2204 and EPC2218.All three products are compared in the table below.EPC2055 has the same die size,packaging process and bump design as EPC2204.EPC2218 has same packaging process as EPC2055 and EPC2204, but has larger die size.
EPC’s eGaN FETs were subjected to a wide variety of stress tests under conditions that are typical for silicon-based power MOSFETs.These tests included:
–High temperature reverse bias (HTRB): Parts are subjected to a drain-source voltage at the maximum rated temperature
–High temperature gate bias (HTGB): Parts are subjected to a gate-source voltage at the maximum rated temperature
–High temperature storage (HTS): Parts are subjected to heat at the maximum rated temperature
–Temperature cycling (TC):Parts are subjected to alternating high- and low temperature extremes
–High temperature high humidity reverse bias (H3TRB):Parts are subjected to humidity under high temperature with a drain-source voltage applied
–Moisture sensitivity level (MSL):Parts are subjected to moisture,temperature, and three cycles of reflow
The stability of the devices is verified with DC electrical tests after stress biasing.The electrical parameters are measured at time-zero and at interim readout points at room temperature.Electrical parameters such as the gate-source leakage,drain-source leakage,gate-source threshold voltage,and on-state resistance are compared against the data sheet specifications.A failure is recorded when a part exceeds the datasheet specifications. eGaN FETs are stressed to meet the latest Joint Electron Device Engineering Council (JEDEC) standards when possible.
Parts for all tests except for TC were mounted onto FR5 (high Tg FR4) or polyimide adaptor cards.Adaptor cards of 1.6 mm in thickness with two copper layers were used.The top copper layer was 1 oz. or 2 oz.,and the bottom copper layer was 1 oz. Kester NXG1 type 3 SAC305 solder no clean flux was used in mounting the part onto an adaptor card.

Brand of Product：	EPC
Part#：	EPC2055 、 EPC2218 、 EPC2204 More Part#
Product Category：	eGaN® FET More
Application：	More
Data Type：	Test Report More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：
Language：	English Chinese Chinese and English Japanese
Date of Creation：	2021
Version Number：
Data Encoding：
Data Size：	191 KB

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