VIncotech’s Mid-power VINcoPACK E3 in A Low-profile Package for Motion Control and UPS Applications
A low-profile package for motion control and UPS applications
Vincotech now has extended the industry-standard low-profile package for mid-power inverters by a sixpack configuration. Engineered mainly for industrial drives, solar power, and UPS applications, the VINcoPACK E3 raises the performance bar with its superior efficiency and reliability. Following the VINcoDUAL E3, the 1200V sixpack power modules VINcoPACK E3 features SLC (SoLid Cover) technology, which combines an insulated metal baseplate and direct potting resin to achieve both high thermal and high power cycling capability. This module is also equipped with the latest low-loss IGBT M7 chips and achieves high power density. The VINco E3 line contains the half-bridge VINcoDUAL E3, this sixpack VINcoPACK E3, and PIM configuration are due to follow.
Main benefits
Extended module lifetime based on the SLC- and IMB Technology
Increased power density featuring the IGBT M7 chip technology
Multiple chip sourcing ensures the highest supply chain safety
Cost competitive w/o expensive base plate component
Features
Industry-standard, low-profile package
Built-in NTC
Scalable product platform
Target applications
Industrial drives
Solar
UPS
VINcoPACK E3 schematic
Low-profile package for mid-power applications
VINcoPACK E3 overview
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