Vincotech’s VINco E3 is Available in 650V, 1200V, and 1700V Versions to Satisfy Market Demand for Mid-power Inverters
The low-profile module improves the efficiency and reliability of your mid-power inverters.
The market is demanding ever more efficient solutions for motion control, solar, and UPS applications. The auspicious pairing of VINco E3 and IGBT M7 chips answers that call. Featuring innovative SoLid Cover (SLC) technology with an Insulated Metal Baseplate and direct potting resin, this new industry-standard, mid-power package achieves both high thermal and high power cycling capability.
VINco E3 housings come in two versions, the VINcoDUAL E3 (VINco E3s), a half-bridge with screw terminals, and the VINcoPACK E3 (VINco E3), a sixpack without screw terminals.
These elegant power units for mid-power inverters are sure to delight your engineers. With the benefit of VINco E3 modules, they are able to boost the output current, power density, and reliability of your designs.
The SoLid Cover technology
The VINco E3's flagship features are IGBT M7 chips and SLC (SoLid Cover) technology. An unprecedented packaging technology built on an Insulated Metal Baseplate (IMB), SLC combines an electrically insulating resin layer with a direct-bonded, topside, and bottom-side copper layer. It replaces the substrate solder layer and separates the baseplate to achieve
High thermal cycling capability
Reduced thermal resistance
High power density and low stray inductance
Direct potting resin distributes the mechanical stress more uniformly than silicone gel for improved power cycling capability
Key features
Low-loss, gen-7 chip technology
SLC and Insulated Metal Baseplate (IMB) technology
Superior thermal cycling capability
• Matched CTE values (IMB, resin, case) to eliminate pump-out
Low-profile package
Integrated NTC
Press-fit pins and pre-applied phase-change material
User Benefits
Longer module lifetime
Increased power density
Simple mounting and easy inverter design and manufacturing
VINco E3 line-up at a glance
VINco E3 is available in 650V, 1200V, and 1700V versions for scalable platform designs
IGBT M7 and Trench IGBT3/IGBT4 chips are available from multiple sources to protect your supply lines
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