Out now: VINco E3, the Low-profile Package for Motion Control, Solar and UPS Applications
Engineered mainly for industrial drives, solar power, and UPS applications, the VINco E3 package raises the performance bar with its enhanced power density and reliability. Featuring the SLC (SoLid Cover) technology in the industry-standard low-profile package, Vincotech’s new VINco E3 package enables engineers to design mid-power inverters with higher output current, higher power density, and improved reliability for industrial drives, solar power, UPS, and other applications.
The IMB (Insulated Metal Baseplate) combines an electrically insulating resin layer with a direct-bonded top- and bottom-side copper layer. It replaces the substrate solder layer and separate baseplate to achieve:
High thermal cycling capability
Reduced thermal resistance
High power density and low stray inductance
Direct potting resin distributes the mechanical stress more uniformly than silicone gel for:
Improved power cycling capability
Comparison of SLC with conventional technology
Main Features:
Low-loss, Mitsubishi gen 7 or Trech IGBT4 chip technology
Extended module lifetime
Industry-standard, low-profile package
Built-in NTC
Scalable product platform
VINco E3 - Line-up:
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