Vincotech‘s New Power Module VINcoNPC X12, Suitable for 1500V DC-link Applications Up to 1MW
Vincotech's new power module VINcoNPC X12 featuring Mitsubishi 1200V gen 7 chips for 1500V DC-link applications up to 1MW. Housed in a low-inductive package, this neutral-point clamped module's superior design comes with many benefits: Connections are optimized for three-level topologies simplifying the busbar design. The symmetrical layout serves to share current uniformly and distribute temperature evenly to extend component life. The outstanding power density and efficiency enables more compact designs.
Basic module information
• Break down voltage:1500V
• Nominal chip current rating:1200A
• Topology:Three-level NPC (I-Type)
• Chip technology (main switch):IGBT M7
• Base isolation:Al2O3
• Electrical interconnection:Screw terminals
Main benefits
• Up to 1MW at 99% efficiency without paralleling modules
• Enhances three-level topologies' benefits and reduces design effort
• Fully symmetrical layouts for better current distribution and higher reliability
• Now available with phase-change thermal interface material
Applications
• Solar
• UPS
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