New flowDUAL E3 SiC Provides Greater Scalability for the high-power Application,More Than Just a Half-Bridge

2023-11-10 VINCOTECH News
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Engineered for maximum power density, this half-bridge module can serve to construct excellent H-bridges and sixpacks. For higher current handling, enhanced power loss dissipation, and greater scalability than a solution with a single-module footprint – the flowDUAL delivers all this and more. 

In combination with Vincotech VINcoPress and advanced die-attach technology, this new baseplate-less module is your first choice for a wide range of high-power use cases where utmost efficiency and reliability are top priorities.

Find more about the technical details on the product page.


flowDUAL E3 SiC Main benefits

  • Outstanding, ≥99% conversion efficiency brings down overall costs

  • Low stray inductance and symmetrical chip layout enable higher switching frequency and lower system costs

  • Greater supply chain security with
    – the new flow E3 industry standard-compatible housing (CTI >600)
    – the latest multi-sourced SiC devices

  • Excellent thermal performance with VINcoPress technology to decrease junction temperature and increase lifetime

  • Pre-applied PC-TIM rated for 150℃ helps reduce production cost


Applications

  • Industrial drives

  • Embedded drives

  • EV Chargers

  • Solar

  • UPS

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