New flowDUAL E3 SiC Provides Greater Scalability for the high-power Application,More Than Just a Half-Bridge
Engineered for maximum power density, this half-bridge module can serve to construct excellent H-bridges and sixpacks. For higher current handling, enhanced power loss dissipation, and greater scalability than a solution with a single-module footprint – the flowDUAL delivers all this and more.
In combination with Vincotech VINcoPress and advanced die-attach technology, this new baseplate-less module is your first choice for a wide range of high-power use cases where utmost efficiency and reliability are top priorities.
Find more about the technical details on the product page.
flowDUAL E3 SiC Main benefits
Outstanding, ≥99% conversion efficiency brings down overall costs
Low stray inductance and symmetrical chip layout enable higher switching frequency and lower system costs
Greater supply chain security with
– the new flow E3 industry standard-compatible housing (CTI >600)
– the latest multi-sourced SiC devicesExcellent thermal performance with VINcoPress technology to decrease junction temperature and increase lifetime
Pre-applied PC-TIM rated for 150℃ helps reduce production cost
Applications
Industrial drives
Embedded drives
EV Chargers
Solar
UPS
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