EPC2071 FEA thermal simulation
■A power dissipation of 1 W in the device active area is assumed.
■Finite element analysis (FEA) thermal simulations
●RΘJB and RΘJC are obtained by stationary simulations.
●ZΘJB and ZΘJC are obtained by transient simulations.
■R-C thermal model is generated.
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Application note & Design Guide |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2022/6/8 |
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1.3 MB |
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