Semiconductor IC Package Design Services

PublishTime：2021-12-30

● Amkor’s design engineers are trained experts and are experienced in the latest design tools and packaging technology. This allows our World Class Design Centers to reduce design cycle times and provide expert advice and service to our customers.
● Amkor plays a leading role in supporting customers in the development of next generation package design for existing and emerging products. We process thousands of new designs for our customers every year. As a result, we have an unparalleled level of package design expertise and can provide World Class leadframe, laminate or wafer level design services, including:
■ Highly trained and experienced design staﬀ
■ Quality, reliable and cost eﬀective designs
■ Design for Performance (DFP), Design for Manufacturing (DFM) and Design for Cost (DFC)
■ Customer assistance to meet thermal, electrical and mechanical requirements

Brand of Product：	AMKOR
Part#：
Product Category：	Semiconductor IC More
Application：	More
Data Type：	Supplier and Product Introduction More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：
Language：	English Chinese Chinese and English Japanese
Date of Creation：	1/19
Version Number：
Data Encoding：	BR402F
Data Size：	2.4 MB

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