EPC21601 eToF Laser Driver IC Wins ASPENCORE’s World Electronics Achievement Award – Product of the Year 2021 Power Semiconductor / Driver IC
November 3, 2021 - Efficient Power Conversion Corporation (EPC), the world’s leader in enhancement-mode gallium nitride on silicon (eGaN®) power FETs and ICs, has won the Product of the Year 2021 – Power Semiconductor/Driver IC of the prestigious World Electronics Achievement Awards (WEAA) for EPC21601 eToF™ Laser Driver IC.
The WEAA scheme honors products that have made outstanding contributions to the innovation and development of the electronics industry worldwide. A committee comprising of ASPENCORE global senior industry analysts and online users worldwide select the winners. ASPENCORE is the largest electronics industry media and SaaS group in the world featuring media titles including EE Times and EDN.
Commenting on the award win, the CEO and Co-founder of Efficient Power Conversion Dr. Alex Lidow said:“On behalf of EPC team, I would like to thank ASPENCORE team and all voters for this prestigious World Electronics Achievement Award for our EPC21601 eToF laser driver IC. Recent advances in our GaN IC technology are poised to change the way time-of-flight lidar systems are designed. Integrating an eGaN FET plus driver on one chip generates an extremely powerful, blazing fast IC and reduces size and cost for ToF lidar systems with wider adoption in consumer applications.”
EPC21601 eToF™ Laser Driver IC integrates a 40V, 10A FET with integrated gate driver and 3.3V logic level input in a single chip for time-of-flight lidar systems used in robotics, surveillance systems, drones, autonomous cars, and vacuum cleaners.
The EPC21601 is capable of very high frequencies exceeding 100MHz and super short pulses<2ns to modulate laser driving currents up to 10A. Turn-on and turn-off times are 410ps and 320ps respectively.
The EPC21601 is a single-chip driver plus eGaN FET using EPC's proprietary GaN IC technology in a chip-scale BGA form factor that measures only 1.5mm x 1.0mm. With this small form factor and the integration of several functions, the overall solution that is 36% smaller on the printed circuit board (PCB) compared to an equivalent multi-chip discrete implementation.
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