Packaging ICs to survive the automotive environment
● To survive these tests and operate reliably over their expected lifetime in a variety of vehicles and systems, assembly processes for automotive ICs have several unique aspects to ensure packaging reliability and durability. The extent of unique processing and tests depends upon the vehicle system where the IC is employed.
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Technical Documentation |
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Please see the document for details |
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SOIC;TSSOP;MLF®;QFN;TQFP;BGA;CSP;fcCSP;FCBGA;TMV® |
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English Chinese Chinese and English Japanese |
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October • 2015 |
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2 MB |
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