EPC2054 Thermal Model
●The thermal model applies to EPC2054.
●A power dissipation of 1W in the device active area is assumed.
●Finite element analysis (FEA) thermal simulations•RΘJB and RΘJC are obtained by stationary simulations.
●ZΘJB and ZΘJC are obtained by transient simulations.
●R-C thermal model is generated
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Application note & Design Guide |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2021/06/16 |
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796 KB |
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