Vincotech flow E1/E2 Power Module With IGBT M7 for Higher Power Density up to 50A (PIM) and 100A (sixpack)
FlowPIM & flowPACK E1/E2 power modules with IGBT M7 are available and ready to ship.
Featuring superior thermal performance and the IGBT M7 chip technology, these modules provide customers with enhanced efficiency while reducing supply chain issues. Discover the PIM (CIB) and sixpack configurations with the power range extending up to 50A (PIM) and 100A (sixpack).
Benefits
20 % better thermal performance (Rth(j-s)) than the competition for extended life, more power, and greater reliability
Smaller packages such as the 25A PIM in flow E1 for higher power density
Real multiple sources down to chip level for enhanced supply chain security
Easy assembly with pre-applied phase-change material and Press-fit pins
Features
Key housing features:
12 mm low-inductive standard industrial package
Pre-bent DCB for excellent thermal contact with the heat sink
CTI 600 housing material
Press-fit pins with stress-relive zone
Optional Phase-change material
Key electrical features:
Lowest on-stage voltage Vce(sat)
Optimized dynamic losses
Improved FWD softness
Enhanced dV/dt controllability
Output power losses benchmark
The chart on the left compares output power at the maximum allowed Tj temperature of 150°C at switching frequencies ranging from 2 to 16kHz. The flowPIM E2 1200V/25A module and a competitor’s equivalent module were benchmarked to this end. This bench test revealed that the new flowPIM E2 featuring the IGBT M7 outperforms the competition by delivering up to 15% higher output power.
flow E with IGBT M7 - product range overview
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