Handling Instructions for flow S3 packages
■The flow S3 type modules have to be mounted to a PCB. The electrical connections between module and the PCB made by using soldering or Press-fit technology. In applications where the module is attached to a heat sink, the PCB must also be attached to this heat sink.
■The distance between the top surface of the heat sink and the bottom plane of the PCB is defined by the module type, which is 12 mm. PCB spacers can be used to obtain the correct spacing. The number and the position of the fixing points depend on the design of the circuit, the location of different masses like capacitors or inductors and the environment of the system. General recommendation cannot be given.
■Recommended assembly sequence:
▲Attach module to the PCB
▲Position and fix the assembled PCB with spacers to the heat sink
▲Fix the module to the heat sink
■A single solder pin can be pushed or pulled maximum ±0.2 mm with a force not more than 35 N during the assembly process. The special design of the Press-fit pin prevents a deformation of more than 0.1 mm when a push force is applied during the press-in process. A deformation of maximum 0.2 mm by applying a pulling force of not more than 35 N during the assembly process is allowed.
■The tension of the pin must not exceed ±5 N at a maximum substrate temperature of 100 °C, this condition is fulfilled if the recommended spacers are used.
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B0-SP10S3A100S7-LR69L08T-/7/ 、 B0-SL10S3A100S710-LR69L03Z-/7/ |
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User's Guide |
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Please see the document for details |
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S3 |
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English Chinese Chinese and English Japanese |
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24.11.2021 |
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Rev. 04 |
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2.6 MB |
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