ATP 9x10 e.MMC Embedded Flash Storage Solution Commercial-Grade Configuration for Read-Intensive Applications
■40% Less Space of Footprint
■Complies with JEDEC e.MMC v5.1 Standard (JESD84-B51)
■153-ball FBGA (RoHS compliant, "green package")
■LDPC ECC engine
■Designed with 3D TLC NAND
●Smaller than a typical e.MMC, ATP 9x10 e.MMC comes in a 153-ball fine pitch ball grid array (FBGA package). The tiny footprint/package size makes it perfectly suitable for embedded systems with space constraints. Its low power consumption will be a major factor in wearable device configuration.
●ATP e.MMC is built to meet the tough demands of commercial applications. As a soldered-down solution, it is secure against constant vibrations. Its commercial temperature rating means that scenarios from cold -25°C to hot 85°C will not cause an adverse impact on the device or the data in it.
●Compliant with the latest JEDEC e.MMC 5.1 Standard (JESD84-B51), ATP e.MMC features Command Queuing and Cache Barrier to enhance random read/write performance; High Speed 200MHz DDR Mode (HS400) for a bandwidth of up to 400 MB/s; Enhanced Strobe in HS400 Mode facilitates faster synchronization between the host and the e.MMC device; and Field firmware update (FFU) make end application easier to resolve problems in the far-end field. Secure Write Protection ensures that only trusted entities can protect or unprotect the e.MMC device.
●It is backward compatible with previous versions (v4.41/v4.5/v5.0), supporting features such as power-off notifications, packed commands, cache, boot or replay protected memory block (RPMB) partitions, and high priority interrupt (HPI).
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[ Read-Intensive Applications ][ wearable device ][ embedded systems ] |
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Supplier and Product Introduction |
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Please see the document for details |
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FBGA |
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English Chinese Chinese and English Japanese |
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202207 |
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v1.0 |
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1.9 MB |
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