ATP e.MMC v5.1 Embedded Flash Storage Solution PRODUCT FLYER

PublishTime：2022-03-15

●The ATP industrial e.MMC is an advanced storage solution that integrates NAND flash memory, a sophisticated flash controller, and a fast MultiMedia Card (MMC) interface in the same package. By incorporating these components in an integrated package, ATP e.MMC manages all background operations internally, freeing the host from handling low-level flash operations for faster and more efficient processing.
●Smaller than a typical postage stamp, ATP e.MMC comes in a 153-ball fine pitch ball grid array (FBGA package). The tiny footprint makes it perfectly suitable for embedded systems with space constraints but require rugged endurance, reliability and durability in harsh environments.
●ATP e.MMC is built to meet the tough demands of industrial applications. As a soldered-down solution, it is secure against constant vibrations. Its industrial temperature rating means that severe scenarios from freezing cold -40°C to blistering hot 105°C will not cause adverse impact on the device or the data in it.
●Compliant with the latest JEDEC e.MMC 5.1 Standard (JESD84-B51), ATP e.MMC features Command Queuing and Cache Barrier to enhance random read/write performance; High Speed 400 (HS400) DDR Mode for a bandwidth of up to 400 MB/s; and field firmware update (FFU). Cache Flushing Report ensures the data integrity on cache blocks; Enhanced Strobe in HS400 Mode facilitates faster synchronization between the host and the e.MMC device; and, Secure Write Protection ensures that only trusted entities can protect or unprotect the e.MMC device.
●It is backward compatible with previous versions (v4.41/v4.5/v5.0), supporting features such as power-off notifications, packed commands, cache, boot or replay protected memory block (RPMB) partitions, high priority interrupt (HPI), and hardware (HW) reset.
●Key Features
■AEC-Q100 Grade 2 (-40°C~105°C) Compliant
■AEC-Q100 Grade 3 (-40°C~85°C) Compliant
■Extra-high endurance: 2-3X higher than standard e.MMC
■Complies with JEDEC e.MMC v5.1 Standard (JESD84-B51)
■153-ball FBGA (RoHS compliant, "green package")
■LDPC ECC engine
■Designed with 3D NAND

Brand of Product：	ATP
Part#：	E700Pa 、 E600Sa 、 E700Paa 、 E600Saa 、 E700Pia 、 E600Sia 、 E750Pi 、 E700Pi 、 E650Si 、 E600Si 、 E750Pc 、 E700Pc 、 E650Sc 、 E600Vc More Part#
Product Category：	Managed NAND More
Application：	[ embedded systems ][ industrial applications ] More
Data Type：	Supplier and Product Introduction More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：	FBGA
Language：	English Chinese Chinese and English Japanese
Date of Creation：	202201
Version Number：	v1.0
Data Encoding：
Data Size：	405 KB

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