E700Pi Series AF010GEC5A-SEK0111 Industrial-Grade SLC mode e.MMC Data Sheet
●The Industrial-grade ATP e.MMC (Embedded MultiMediaCard) solution is designed to meet high-performance data transfer, code, data storage, infotainment, and other commercial application requirements. Compliant with the latest JEDEC e.MMC v5.1 specification, the ATP e.MMC is an embedded storage solution consisting of an MMC interface, flash memory and controller integrated in the same IC package and offered in an industry standard ball grid array (BGA) package. The integrated package simplifies the application interface design, making the ATP e.MMC suitable for embedded and commercial applications.
●Enhanced v5.1 features include Command Queuing, High Speed 400 (HS400) DDR Mode for a bandwidth of up to 400 MB/s, and field firmware update (FFU). The ATP e.MMC v5.1 is backward compatible with previous versions (v4.41/v4.51/v5.0), supporting features such as power-off notifications, packed commands, cache, boot or replay protected memory block (RPMB) partitions, high priority interrupt (HPI), and hardware (HW) reset.
●Constructed using 3D TLC NAND flash memory, the ATP e.MMC achieves higher densities with up to 64 GB of memory for use in mass storage applications. The MMC interface allows easy integration with any microprocessor with MMC host. Any revision to or amendment of the NAND is invisible to the host as the embedded MMC controller insulates NAND technology from the host, leading to faster product development as well as faster time to market.
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Datasheet |
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Please see the document for details |
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FBGA |
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English Chinese Chinese and English Japanese |
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Jul. 28th 2020 |
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Revision 1.0 |
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3.8 MB |
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