ATP Reaffirms Commitment to Long-Term DDR3 Legacy Memory Module Supply with ATP DDR3 8 Gbit components
●ATP-Built from IC to Module
■ATP’s own-built DDR3 modules consist of meticulously characterized and tested high-quality integrated circuits (ICs). The components are manufactured according to ATP’s exacting standards using 2x nm manufacturing process technology and are tested via an extensive component test program to improve the overall memory module performance.
■ATP DDR3 8 Gbit components are free from row hammer effects, thus preventing any disastrous random bit flips caused by the electrical charge of cells leaking to adjacent cells and successively writing data to them. At module level, ATP implements 100% test during burn-in (TDBI) into the production flow to guarantee the high quality module.
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Supplier and Product Introduction |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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022024 |
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v1 |
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2.1 MB |
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