ATP Reaffirms Commitment to Long-Term DDR3 Legacy Memory Module Supply with ATP DDR3 8 Gbit components
●As the DRAM market makes a steady migration to DDR4 memory, several key manufacturers have already announced end-of-life (EOL) production of DDR3 modules based on high density DDR3 8 Gbit components including EOL notice of the components. However, a sizable number of customers in the networking and embedded industries are still unable to shift to the latest generation and continue to use legacy systems requiring specific DDR3 memory such as high-density SO-DIMMs. To avert a supply shortage that could adversely affect these customers’ business operations, ATP has decided to provide its own DDR3 8 Gbit components for these modules.
●ATP-Built from IC to Module
■ATP’s own-built DDR3 modules consist of meticulously characterized and tested high-quality integrated circuits (ICs). The components are manufactured according to ATP’s exacting standards using 2x nm manufacturing process technology and are tested via an extensive component test program to improve the overall memory module performance.
■ATP DDR3 8 Gbit components are free from row hammer effects, thus preventing any disastrous random bit flips caused by the electrical charge of cells leaking to adjacent cells and successively writing data to them. At module level, ATP implements 100% test during burn-in (TDBI) into the production flow to guarantee the high quality module.
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DDR3 Legacy Memory Module 、 DDR3 modules 、 DDR3 UDIMM 、 DDR3 SO-DIMM |
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Supplier and Product Introduction |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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102023 |
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v1.2 |
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2.1 MB |
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