ATP DDR3 Configurations
A typical monolithic DDR3 DRAM chip has a density of 4 Gigabits (Gb). To pack 8 Gb in a monolithic DRAM die, manufacturers
employ a die-stacking method called dual-die package (DDP), which combines two bare memory dies within a single chip package.
Each die has a separate set of control lines where each memory die is separately selectable, and the processor treats the chip
as two components despite being in the same package.
ATP DDR3 components are available in monolithic 8 Gb one-chip select (1CS) or as DDP two-chip select (2CS) for a variety
of memory modules based on this technology.
With ATP’s own-built DDR3 modules, the company reaffirms its commitment to continue supporting legacy memory requirements
to maximize customers’ infrastructure investments.
DDR3 UDIMM
Capacity (GB) Form Factor Ranks Component Org Component Qty. Technology
Speed up to
(MT/s)
16
UDIMM ECC 2 1G x 8 18 Mono 1600
Capacity (GB) Form Factor Ranks Component Org Component Qty. Technology
Speed up to
(MT/s)
16
SO-DIMM ECC 2 1G x 8 18 Mono 1600
16
SO-DIMM 2 1G x 8 16 Mono 1600
v1.2 102023
© Copyright 2022 ATP Electronics, Inc. All rights reserved.
We build With you
The Global Leader in Specialized Storage and Memory Solutions
TEL: +886-2-2659-6368
sales-apac@atpinc.com
TEL: +1-408-732-5000
sales@atpinc.com
ATP EUROPEATP USAATP TAIWAN (HQ)
TEL: +49-89-374-9999-0
sales-europe@atpinc.com
ATP JAPAN
TEL: +81-3-6260-0797
sales-japan@atpinc.com
TEL: +86-21-5080-2220
sales@cn.atpinc.com
ATP CHINA
Product spec and its related information are subject to change without advance notice.
Please refer to www.atpinc.com for latest information
16
UDIMM 2 1G x 8 16 Mono 1600
DDR3 SO-DIMM