ATP ELECTRONICS Rolls Out SSDs with 100+ Layer 3D NAND for Industrial/embedded Applications
Taipei, Taiwan (May 2022) –ATP ELECTRONICS, the global leader in specialized storage and memory solutions, rolls out its N600Vc Series M.2 2242/2280 NVMe 1.3 PCIe Gen3x4 and A600Vc Series SATA 2.5”, M.2 2242/2280, and mSATA Value Line solid-state drives (SSDs). Built with triple-level cell (TLC) NAND on leading 100+-layer 3D architecture, the new line is geared toward industrial applications/embedded applications requiring reliable performance, a wide range of capacity options, and long-term supply commitment at friendly price points.
Prime Quality with IC Sorting at Value Price
The new N600Vc/A600Vc Series SSDs offer a lower cost per GB compared to ATP’s mainstream Superior Line, but use prime NAND die along with ATP’s superior integrated circuits (IC) sorting process to guarantee drive quality, performance, reliability, and endurance better than other SSD solutions in the market that use pre-packaged ICs instead of wafers or die.
The Value Line is tailored for read-intensive applications, such as web servers, box pc, kiosk/point-of-sale systems (POS), and other industrial/embedded boot drives requiring speed and reliability.
Lower Cost per GB with a Wide Range of Capacity Offerings
The N600Vc Series is available in capacities from 120 GB to 960 GB for M.2 2280/2242, while the A600Vc Series is available in capacities from 128 GB to 1 TB for M.2 2242/2280, 2.5” and mSATA to offer more cost-effective options for applications with varied storage requirements.
Cost-Effective, DRAM-less Storage, and Data-at-Rest PLP
The N600Vc/A600Vc Series Value Line SSDs are DRAM-less, which means that logical data maps are stored on the NAND flash instead of the dynamic random access memory (DRAM). This makes the N600Vc/S600Vc Series ideally suited for heavy random-read applications such as booting, which require minimal or even no write operations. They are also faster alternatives to mechanical drives and make good alternatives for those who wish to make the transition.
Having no DRAM also means less-complex operations, which translates to lower power draw and thus, higher power savings.
For the N600Vc Series, Host Memory Buffer (HMB) is a key feature. This helps reduce latencies by allowing the host driver to allocate a portion of its system memory for the exclusive use of the SSD as a cache for address mapping information and/or user data.
The new NVMe/SATA offerings are available with C-Temp (0 to 70°C) support. Firmware-based power-loss protection (PLP) safeguards data at rest or stored data and minimizes the effects of a sudden power loss by creating multiple backups of the in-system programming (ISP) code and link table mapping address.
Specifications
1 Case Temperature, the composite temperature as indicated by SMART temperature attributes. 2 Under highest Sequential write value. May vary by density, configuration, and applications.
- 【Datasheet】ATP 100+ Layer Prime Die 3D NAND SSD Built for Industrial Applications : Value Line with 3D TLC NAND Offers Prime Quality, Reliability and Endurance at Lower Cost per GB
- 【Datasheet】N600Vi/N600Vc Series I-Temp/C-Temp NVMe PCIe Gen3x4 1620 HSBGA TLC SSD Datasheet
- 【Datasheet】ATP mSATA Embedded SSD
- 【Datasheet】ATP 2.5" SATA SSDs Industrial Grade
- 【Datasheet】ATP M.2 SATA Industrial Grade
- 【Datasheet】ATP mSATA Embedded SSD
- 【Datasheet】A800Pi ATP M.2 SATA Embedded SSD
- 【Datasheet】A800Pi ATP 2.5" SATA SSDs Industrial Grade
- 【Datasheet】A800Pi ATP mSATA Embedded SSD
- 【Datasheet】ATP M.2 SATA Embedded SSD
- 【Datasheet】ATP 2.5" SATA SSDs Industrial Grade
- 【Datasheet】ATP mSATA Embedded SSD
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