BERGQUIST GAP FILLER TGF 3600 Known as BERGQUIST GAP FILLER 3500S35 Technical Data Sheet
● A thermally conductive, liquid gap filler material.
■FEATURES AND BENEFITS
● Thermal Conductivity: 3.6 W/m-K
● Thixotropic nature makes it easy to dispense
● Two-part formulation for easy storage
● Ultra-conforming, designed for fragile and low-stress applications
● Ambient and accelerated cure schedules
■BERGQUIST GAP FILLER TGF 3600 is a two-component liquid gap filling material, cured at either room or elevated temperature, featuring ultra-high thermal performance and superior softness. Prior to curing, the material maintains good thixotropic characteristics as well as low viscosity.
■The result is a gel-like liquid material designed to fill air gaps and voids yet flow when acted upon by an external force (e.g. dispensing or assembly process). The material is an excellent solution for interfacing fragile components with high topography and/or stack-up tolerances to a universal heat sink or housing.
■Once cured, it remains a low modulus elastomer designed to assist in relieving CTE stresses during thermal cycling yet maintain enough modulus to prevent pump-out from the interface. BERGQUIST GAP FILLER TGF 3600 will lightly adhere to surfaces, thus improving surface area contact. BERGQUIST GAP FILLER TGF 3600 is not designed to be a structural adhesive.
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BERGQUIST GAP FILLER TGF 3600 、 BERGQUIST GAP FILLER 3500S35 |
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two-component liquid gap filling material 、 thermally conductive liquid gap filler material. |
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[ Automotive electronics (HEV, NEV, batteries) ][ PCBA to housing ][ Discrete components to housing ][ Fiber optic telecommunications equipment ] |
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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October 2018 |
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69 KB |
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