BERGQUIST GAP FILLER TGF 3000SF Technical Data Sheet
● Thermal Conductivity: 3.0 W/m-K
● Dispensable liquid, 2K Silicone free Gap Filler
● Room temperature cure - no oven required
● Extremely high dispense rate: Equipment dependent
● Low compression stress during assembly
■BERGQUIST GAP FILLER TGF 3000SF is a non-silicone, 2-part room temperature curable gap filler suitable for use in high throughput assembly applications. With a 3.0 W/m-K thermal performance, it provides an excellent silicone-free solution required in the assembly of high performance power devices.
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[ Silicone sensitive applications ][ Processes requiring high dispense rate ][ Applications requiring high thermal transfer and low compressive stress ] |
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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October 2021 |
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70 KB |
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