BERGQUIST GAP FILLER TGF 4500CVO Technical Data Sheet
●BERGQUIST GAP FILLER TGF 4500CVO is a two-part, high performance, thermally conductive, liquid gap filling material. The mixed material will cure at room temperature. Cure can be accelerated with the addition of heat.
●BERGQUIST GAP FILLER TGF 4500CVO has controlled volatile outgassing silicones for sensitive applications and high dispensing rate in customer application. This liquid-dispensed material offers infinite thickness variation and impart little and reduced stress on components during assembly. As cured, BERGQUIST GAP FILLER TGF 4500CVO offers a soft, thermally conductive, form-in-place elastomer to fill voids and gaps in the customer assembly.
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[ Power inverter ][ Surface mount power switching ][ EV charger ][ Use between heat generating semiconductor packages and heat sink ] |
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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November 2020 |
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73 KB |
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