BERGQUIST GAP FILLER TGF 1100SF Thermally Conductive, Silicone-Free Gap Filling Material Technical Data Sheet
●Thermally Conductive, Silicone-Free Gap Filling Material.
▲Technology：Silicone free
▲Appearance (cured)：Orange
▲Appearance - Part A：Yellow
▲Appearance - Part B：Red
▲Cure：Room temperature cure or Cure at elevated temperatures
▲Application：Thermal management, TIM (Thermal Interface Material)
▲Mix Ratio by weight： Part A: Part B：1 :1
▲Mix Ratio by volume：Part A: Part B：1 :1
▲Solids Content, %:100
▲Operating Temperature Range: -60 to125°C
■FEATURES AND BENEFITS
◆Thermal Conductivity: 1.1 W/m-K
◆No silicone outgassing or extraction
◆Ultra-con forming, designed for fragile and low-stress applications
◆Ambient and accelerated cure schedules
◆100% solids - no cure by-products
■BERGOUIST GAP FILLER TGF1100SF is a high performance, thermally conductive liquid gap filling material whichexhibits low modulus properties then cures to a soft, flexible eastomer, helping reduce thermal cycling stresses during operation and virtually eliminating stress during assembly of low-stress applications.
■The mixed system will cure at ambient. BERGOUIST GAP FILLER TGF 1100SF offers infinite thickness variations with little or no stress to the sensitive components during or following assembly.BERGOUIST GAP FILLER TGF 1100SF is not intended for use in thermal interface applications requiring a mechanical structural bond.
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BERGQUIST GAP FILLER TGF 1100SF 、 BERGQUIST GAP FILLER 1100SF |
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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June-2019 |
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71 KB |
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