BERGQUIST GAP FILLER TGF 2000 Technical Data Sheet
■ A thermally conductive, liquid gap filler material.
▲ Technology: Silicone
▲ Appearance (cured): Pink
▲ Appearance - Part A: Pink
▲ Appearance - Part B: White
▲ Cure: Room temperature cure or Heat cure
▲ Application: Thermal management, TIM (Thermal Interface Material)
▲ Mix Ratio by weight: Part A: Part B: 1 : 1
▲ Mix Ratio by volume: Part A: Part B: 1 : 1
▲ Solids Content, %: 100
▲ Operating Temperature Range: -60 to 200ºC
● FEATURES AND BENEFITS
■ Thermal Conductivity: 2.0 W/m-K
■ Ultra-conforming, designed for fragile and low-stress applications
■ Ambient and accelerated cure schedules
■ 100% solids - no cure by-products
■ Excellent low and high temperature mechanical and chemical stability
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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October 2018 |
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69 KB |
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