BERGQUIST GAP FILLER TGF 2000 Technical Data Sheet
■ A thermally conductive, liquid gap filler material.
▲ Technology: Silicone
▲ Appearance (cured): Pink
▲ Appearance - Part A: Pink
▲ Appearance - Part B: White
▲ Cure: Room temperature cure or Heat cure
▲ Application: Thermal management, TIM (Thermal Interface Material)
▲ Mix Ratio by weight: Part A: Part B: 1 : 1
▲ Mix Ratio by volume: Part A: Part B: 1 : 1
▲ Solids Content, %: 100
▲ Operating Temperature Range: -60 to 200ºC
● FEATURES AND BENEFITS
■ Thermal Conductivity: 2.0 W/m-K
■ Ultra-conforming, designed for fragile and low-stress applications
■ Ambient and accelerated cure schedules
■ 100% solids - no cure by-products
■ Excellent low and high temperature mechanical and chemical stability
|
|
Datasheet |
|
|
|
Please see the document for details |
|
|
|
|
|
|
|
English Chinese Chinese and English Japanese |
|
October 2018 |
|
|
|
|
|
69 KB |
- +1 Like
- Add to Favorites
Recommend
- High-Performance Thermal Gap Filler Pads to Further Optimise Heat Transfer Applications in Electronic Systems
- Laird Releases Tflex™ Sf10 Series, a Silicone-free Gap Filler Delivering 10 W/mk Thermal Conductivity
- Enterprise Air Blocker Solution Case Study From BOYD
- What is Air Gap Bonding?
- Closing the Performance Gap Between DRAM and AI Processors
- Melexis‘ MLX81346 single chip LIN pre-driver controls motors up to 2000 W, assisting high power mechatronic miniaturization
- AC-DC Power Supply: Bridging the Gap Between Alternating and Direct Current
- Nippon Chemi-Con Developed MHL Series of SMD Type Aluminum Electrolytic Capacitors Guaranteeing 2000 to 4000 Hours at 125℃
All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.