EPC Thermal Modeling Calculator Quick Start Guide

PublishTime：2022-05-24

●The presented Thermal Calculator, a GaN Power Bench tool, provides quick estimates for the thermal performance parameters of PCB-mounted GaN devices subject to both board-side cooling through forced convection, and backside cooling through a thermal solution consisting of a heat spreader and heatsink.The model accounts for the PCB construction (size, stack-up and via density), die sizes, power losses, TIM materials and heat sink solution. We present in this text the basic layout of the Thermal Calculator user interface and simple instructions on how to define the input parameters and run the thermal model.
●The model allows to compare the thermal performance of the GaN FETs with and without backside cooling and can be used to quickly estimate the effect of using different TIM pads and TIM gap fillers.In addition, the cooling effect of the heat spreader and heatsink can be quickly assessed. Two configurations are considered: one for a single FET and another for two FETs in a half-bridge circuit. The different input parameters required for the model can be inputted using a simple and intuitive graphical user interface (GUI) after which the model calculates individual thermal resistances values (Rth) and the operating junction temperatures (TJ) for a defined power loss.

Brand of Product：	EPC
Part#：
Product Category：	More
Application：	More
Data Type：	User's Guide More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：
Language：	English Chinese Chinese and English Japanese
Date of Creation：	2021/11/19
Version Number：	Revision 3.0
Data Encoding：
Data Size：	1 MB

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