NEW PRODUCT INTRODUCTION THERM-A-GAP GEL 75
■What Is a THERM-A-GAP GEL?
▲Single component dispensable TIM
▲Dispensed by hand or automated equipment
▲Does not require any post cure process
▲Form stable in horizontal or vertical applications
▲Lower assembly costs when compared to thermal gap pads for higher volume applications
THERM-A-GAP GEL 75 、 65-00-GEL75-0010 、 65-02-GEL75-0030 、 65-02-GEL75-0180 、 65-00-GEL75-0300 、 65-1P-GEL75-2500 、 65-5P-GEL75-7500 、 THERM-A-GAP GEL |
|
[ Telecom ][ IT Markets ][ Automotive Power Electronics ][ Telecom Base Stations ][ Central Processing Units ][ Power Supplies ][ Semiconductors ][ Memory/Power Modules ][ LIDAR ][ RadarADAS Modules ][ DC/DC Converters ][ Power Modules ][ Engine Control Units (ECUs) ] |
|
Supplier and Product Introduction |
|
|
|
Please see the document for details |
|
|
|
|
|
|
|
English Chinese Chinese and English Japanese |
|
|
|
|
|
|
|
2 MB |
- +1 Like
- Add to Favorites
Recommend
- New THERM-A-GAP GEL 75 Thermal Gel Offers High Thermal Conductivity and Reliability
- Parker Chomerics‘ THERM-A-GAP™ Gel 20 One-component Thermal Interface Material with 2.4W/m-k Thermal Conductivity Ideal for Automotive Industry Applications
- Parker Releases High-Flow Thermal Gel THERM-A-GAP™ GEL 60HF Offering Flow Rates of up to 100g/min for High-Volume Applications
- 5.2W/m-K High Reliability, Fully Cured, Dispensable Thermal Gel from Parker Chomerics
- QSFP-DD Optical Transceiver Thermal Interface Materials with Greater Density, Greater Heat
- News | Thermal Interface Materials for Challenging Private Spaceflight Applications
- High-Performance Thermal Gap Filler Pads to Further Optimise Heat Transfer Applications in Electronic Systems
- On the Cutting Edge: How Parker Chomerics Helps SpaceX Soar
All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.